We utilize a variety of advanced methods in our thickness testing programs. Our capabilities are especially valuable in measuring thin platings in applications where film thickness is critical to corrosion resistance or electrical properties. Both non destructive and destructive methods are available to meet specific client needs.
X-ray fluorescence, microsectioning and through-hole photo-micrography methods are employed on a routine basis.
We utilize a variety of advanced methods in our thickness testing programs. Our capabilities are especially valuable in measuring thin platings in applications where film thickness is critical to corrosion resistance or electrical properties. Both non destructive and destructive methods are available to meet specific client needs.